As electronic components grow ever more miniaturized, finding an efficient protection method has become an industry-wide challenge. The addition-cure electronic potting compound 1300 series, with its unique 1:1 mix ratio, low viscosity and wide temperature tolerance, is emerging as a next-generation protective solution.

Performance Highlights  
• Cures via addition-reaction chemistry, delivering low viscosity of 1,500–3,000 mPa·s (e.g., grade 1300: 1,500 ± 500 mPa·s) for penetration into micron-scale gaps.  
• Thermal conductivity up to 0.8 W/m·K (grades 1301–1305), well above industry averages and ideal for high-power heat dissipation.  
• Stable dielectric and mechanical performance from –50 °C to 250 °C: εr 2.7–3.3, tensile strength 0.5–1.5 MPa.

Dual Upgrades in Safety & Protection  
• UL 94 V-0/V-1 flame rating; IPX6 water resistance (1301–1305) protects against short circuits and fire.  
• Volume resistivity ≥ 10^14 Ω·cm and dielectric strength ≥ 15 kV/mm suit high-voltage battery packs, 5G base stations and other demanding insulation scenarios.

Applications  
• Consumer electronics: shields TWS-earbud charging-case PCBs from sweat corrosion.  
• Industrial equipment: vibration-resistant encapsulation for robot sensors.  
• New energy: extends outdoor service life of PV inverters.  
Non-adhesive (No) to substrates, making rework simple and maintenance costs low.

Usage Guide  
Avoid sulfur- or amine-containing substances to prevent cure inhibition. Vacuum de-airing is recommended; 24 h at 23 °C yields full cure. Shelf life: 12 months below 30 °C. Available from 0.5 kg samples to 200 kg drums.  

With electronics trending toward miniaturization and higher power, the 1300 series is poised to reset industry protection standards.