With 5G and AI now commercialized, protection materials must leap from “usable” to “high-performance.” The addition-cure potting compound 1300 series is carving out new paradigms in advanced manufacturing.

Technical Differentiators  
• Wide-temperature stability: 50–60 % elongation at –50 °C, dielectric loss ≤0.02 at 250 °C.  
• EMI/EMC advantage: stable εr 2.7–3.3 reduces 5G mmWave signal attenuation.  
• Environmental compliance: solvent-free, RoHS-certified, meets EU eco-regulations.

Industry-Tailored Solutions  
• Communications: black grade 1302 for base-station antennas—UV + heat dissipation.  
• Medical electronics: transparent 1300 for visual inspection of surgical-device circuits.  
• Aerospace: grade 1305 passed –55 °C ↔ 200 °C thermal-shock tests for satellite payloads.

R&D Partnerships  
National key-lab tests show gray grade 1303 extends fiber-optic sensor life 3× in damp-heat salt-fog and improves signal stability by 40 %.

Future Outlook  
As SiC and GaN semiconductors spread, thermal conductivity (now 0.8 W/m·K max) and processing will keep improving. Early SiC module trials show 20 % lower thermal resistance. Tech documents and one-on-one engineer consultations are offered to accelerate adoption.