The stable operation of electronic components is the core guarantee of equipment performance, and the technological breakthrough of protective materials is pushing this field to a higher standard. The launch of the addition-type electronic potting adhesive series, with its comprehensive protection performance and flexible process adaptability, provides a new solution for the reliable operation of electronic devices in complex environments, attracting widespread attention in the industry.  

The core advantage of this series of products lies in the balanced display of multi-dimensional protection capabilities. It can effectively resist environmental hazards such as impact, vibration, moisture, and ozone. The operating temperature covers -50°C to 250°C, maintaining stable performance whether it is outdoor equipment in extremely cold regions or industrial instruments operating at high temperatures. In terms of safety protection, the flame retardant rating ranges from UL94-HB to V0, and the maximum waterproof rating reaches IPX6, which can meet the protection needs from daily electronic devices to harsh environments. Models such as 1301 and 1302 have a thermal conductivity of ≥0.8W/m·K, which also has efficient heat dissipation function, suitable for the heat dissipation needs of high-power devices.  

The performance parameters demonstrate technical strength. The series includes 4 models, with colors covering white, black, gray, and transparent, meeting different appearance and observation needs. The 1:1 ratio of AB components simplifies the mixing process. The viscosity of 3000±500mPa·s (model 1300 is 2000-2500mPa·s) ensures good fluidity, which can penetrate into the gaps of components to achieve complete wrapping. The electrical properties of volume resistivity ≥10¹⁴Ω·cm and breakdown voltage ≥20KV/mm are excellent, ensuring the insulation safety of circuits; the dielectric constant is 2.7-3.3, and the dielectric loss is ≤0.02, adapting to high-frequency signal transmission scenarios.  

At the production level, the series takes into account both efficiency and stability. It basically cures at room temperature in 24 hours, and can be accelerated in high-temperature environments, flexibly matching the production rhythm; the application of vacuum degassing or automatic potting machines can effectively eliminate bubbles and improve potting quality. The packaging specifications from 0.5kg sample packaging to 200kg mass production packaging meet diverse needs. The shelf life is 12 months when stored below 30°C, which is convenient for inventory management.  

From consumer electronics to industrial control, addition-type electronic potting adhesives are providing solid support for the reliability upgrade of electronic devices with all-round protection capabilities, promoting the electronics manufacturing industry to move towards higher quality.