In the field of precision manufacturing, the operational convenience and performance stability of bonding and potting materials are crucial for improving production efficiency and ensuring product quality. As a low-viscosity two-component product, Silicone Gel IOTA-5118AB has become an ideal choice in fields such as displays, automotive electronics, and solar energy, thanks to its easy operation, excellent performance, and wide adaptability.
The low viscosity of the product before curing brings great convenience to operation. The viscosity of Component A is 1600 mPa·s, Component B is 1300 mPa·s, and the mixed viscosity is 1400 mPa·s. It has good fluidity, like a thin transparent liquid, which can quickly penetrate and fill tiny gaps. Whether potting small electronic components or bonding display glass covers to polarizers, it can evenly cover the surface of the substrate without residual bubbles (simple vacuum defoaming after mixing is sufficient), avoiding problems such as insufficient filling and weak bonding caused by poor fluidity of the adhesive. At the same time, both Components A and B are colorless and transparent liquids before curing, maintaining high transparency after mixing. The light transmittance after curing exceeds 99%, which will not block or affect the original functions of the substrate, making it particularly suitable for scenarios requiring light transmittance.
Performance stability runs through the entire application process. It has excellent mechanical damping performance; after curing, it can effectively absorb vibration energy, reducing damage to electronic components and automotive parts caused by vibration. It is suitable for making damping products or potting parts prone to vibration. Its surface is sticky with reliable bonding strength, and it is not easy to fall off after bonding, ensuring the long-term stable operation of components. The electrical performance remains stable for a long time; insulation and dielectric properties change slightly under different temperatures and environments, providing long-term safety protection for electronic components. Even in complex environments such as high temperature and humidity, it can maintain good performance, extending the service life of products.
The application process is simple and easy to master, lowering the operation threshold. The mixing ratio of Components A and B is 1:1, no complex calculation is required, and even beginners can quickly master it. When mixing manually, only clean tools need to be ensured to avoid contamination; when using automatic mixing equipment, regular glue discharge can prevent the glue from curing in advance. The pot life is reasonable: 1.5 hours at 25℃, which is sufficient for batch glue preparation and application. The curing conditions are flexible: room-temperature curing is suitable for scenarios without high temperature requirements, while high-temperature curing (e.g., 150℃/30min) can significantly shorten the production cycle, adapting to different production rhythms. In addition, by adjusting the ratio of Components A and B (from 1.1:1 to 1.6:1), the gel hardness can be flexibly changed, and dyes can be added for coloring to meet diverse needs.
The packaging and storage design meets the actual needs of enterprises. Components A and B are supplied in matching sets: 15KG small barrels are suitable for small-batch trial production or R&D, and 180KG large barrels meet the needs of large-scale production, avoiding waste. Stored in a sealed environment at 5-30℃, it has a shelf life of 6 months, no special temperature control equipment is required, facilitating daily stock preparation for enterprises. During use, only the cleanliness of the substrate needs to be ensured, and contact with substances that affect curing should be avoided to ensure the stable performance of the product, providing reliable support for production in various fields.
