For electronics manufacturers and R&D teams, a high-quality potting compound must be both easy to use and durable with good storage stability. This addition-type electronic potting compound, with its advantages of zero operational barriers, convenient storage, and long shelf life, has become a "trusted assistant for production and R&D," reducing production costs while improving work efficiency.

In terms of operation, it takes "hassle-free" to the extreme. With a 1:1 mixing ratio, there’s no need for complex weighing or calculations—simply mix the two components in equal weight. After stirring evenly, it’s ready to use, significantly reducing the risk of mixing errors. The mixed compound has excellent fluidity, allowing it to self-level and automatically release bubbles. When used with an automatic dispensing machine, it completely avoids bubble formation, ensuring a more uniform encapsulation result.

The curing process is flexible and controllable. At room temperature, it fully cures within 24 hours, meeting the pace of regular production. If you need to speed things up, slightly increasing the ambient temperature will significantly accelerate the curing process, ensuring no delays in the production line. Even for small-scale R&D testing, encapsulation can be completed quickly, shortening the R&D cycle.

When it comes to storage, it offers peace of mind. As long as it is stored in a sealed environment below 30°C, its shelf life can exceed one year. Even if sedimentation occurs during long-term storage, it only involves internal flame-retardant or thermally conductive materials. After stirring evenly, the performance and quality remain unaffected, with no need to worry about mileage loss.

Packaging options are highly diverse, ranging from 0.5kg sample sizes to 200kg bulk packaging, perfectly suited for R&D testing, small-batch production, and large-scale assembly line operations, effectively avoiding material waste. Whether it’s encapsulating prototypes in the lab or mass production in the factory, you can find the right packaging specification to reduce procurement and storage costs.

Its long-lasting protective capabilities also help reduce subsequent equipment maintenance costs. Encapsulated electronic devices can operate stably for extended periods in complex environments, significantly lowering the repair rate. From the R&D lab to the production floor, this potting compound empowers the electronics industry with its convenience, durability, and hassle-free advantages, serving as a "reliable assistant" for improving production efficiency and ensuring product quality.