In the encapsulation of LED modules, optical sensors, and electronic products with transparent casings, materials must not only possess excellent insulation but also visual transparency and application convenience. A low-viscosity, transparent addition-cure potting adhesive — LSR 3100G — has become a popular choice for precision electronic encapsulation due to its outstanding comprehensive performance.

This product has a viscosity of only 2,000–2,500 mPa·s, offering excellent fluidity that allows it to easily fill micro-gaps, achieving bubble-free and void-free encapsulation. Its fully transparent cured state facilitates visual inspection and optical recognition of components after encapsulation, making it particularly suitable for applications requiring high light transmittance.

In terms of electrical performance, the product exhibits high insulation strength, with a breakdown voltage ≥20 kV/mm and volume resistivity ≥10¹⁴ Ω·cm, effectively preventing circuit short circuits and leakage risks. Its dielectric constant remains stable at 2.7–3.3, with a dielectric loss ≤0.02, ensuring the integrity of high-frequency signal transmission.

The product has a moderate hardness (25–30 Shore A), providing both cushioning properties and good overall support. Its thermal conductivity ≥0.3 W/m·K offers certain heat dissipation capabilities, while its flame retardancy rating of UL94-HB and waterproof rating of IPX4 meet the protection requirements of everyday electronic devices.

In terms of application, the product features a 1:1 mixing ratio, with a working time of 50–60 minutes, making it suitable for the step-by-step potting and adjustment of complex structures. The curing time is approximately 8–10 hours, with full curing achieved at room temperature within 24 hours.

Whether used in transparent power modules, LED driver circuits, or optical sensing components in consumer electronics, LSR 3100G reliably provides insulation protection while meeting the dual needs of visual transparency and application convenience.