With the continuous increase in power density of electronic devices, heat dissipation has become a critical factor affecting device lifespan and reliability. An electronic potting compound featuring high thermal conductivity—represented by the black series products such as LSR 3304G and 3411G—is gradually becoming the "thermal partner" of high-power electronic devices, thanks to its excellent thermal management capabilities.
This product series boasts a thermal conductivity of ≥0.8W/m·K, efficiently transferring heat generated by components to the casing or heat dissipation structure, thereby preventing localized overheating that could lead to performance degradation or damage. Combined with its resistance to extreme temperatures (-50°C to 250°C), this adhesive is suitable for devices with high heat generation, such as inverters, power modules, motor controllers, and photovoltaic inverters.
In terms of electrical insulation, the product also demonstrates outstanding performance: a breakdown voltage of ≥20KV/mm, volume resistivity of ≥10¹⁴Ω·cm, a stable dielectric constant ranging from 2.7 to 3.3, and a dielectric loss of ≤0.02. These properties ensure stable electrical performance even in high-voltage and high-frequency environments.
Additionally, this series offers moderate hardness (30±5 Shore A) and excellent resistance to vibration and impact, effectively protecting precision components from damage during transportation and use. Some models support direct bonding with components without the need for primer treatment, thereby improving production efficiency.
In terms of application, the product has a mixing ratio of 10:1, with a working time of 30–40 minutes and a curing time of 4–6 hours, making it suitable for most production line rhythms. It is recommended to use vacuum degassing or automated dispensing equipment to eliminate air bubbles and enhance encapsulation consistency.
Whether used in industrial drives, automotive electronics, or battery management systems for energy storage, this high-thermal-conductivity potting compound effectively addresses heat dissipation challenges while ensuring electrical safety, providing dual protection for the long-term stable operation of high-power electronic devices.
