In electronic potting production, complex mixing ratios, slow curing and easy bubble formation are three major obstacles to efficiency. Improper ratios cause material waste, room-temperature curing slows down production lines, and difficult bubble removal harms potting quality. A two-component room-temperature-vulcanizing silicone thermal potting compound, with its 1:1 golden mixing ratio, multi-stage fast curing modes and low viscosity for easy bubble elimination, makes potting fast and hassle-free — ideal for both small-batch trials and mass production. It delivers ultimate ease of use: Components A and B are mixed at a 1:1 weight ratio with no complicated calculations, allowing line workers to operate quickly without professional training, fully avoiding material waste and potting defects from ratio errors — even beginners can use it easily. Component A is gray and Component B white; they mix to a uniform gray color for intuitive judgment of thorough mixing, further reducing operational mistakes. Its low viscosity provides excellent fluidity and self-defoaming:

• Component A viscosity: 5000 mPa·s
• Component B viscosity: 4000 mPa·s
• Mixed viscosity: 4500 mPa·s

The compound flows naturally and releases bubbles quickly after injection into components, ensuring bubble-free and void-free potting without complex vacuum degassing equipment, greatly improving yield. At 23℃, the working time reaches 2 hours, providing ample operation time without rushing, effectively reducing defects caused by hasty processing. Curing modes are flexibly adjustable to match production needs:

• 23℃ room temperature: cures in 8 hours, no heating needed — perfect for small-batch R&D and laboratory trials;
• 100℃: cures in 15 minutes for faster production;
• 150℃ high temperature: cures in only 5 minutes for mass assembly lines, maximizing production efficiency and adapting perfectly to different production rhythms.