In a fast-growing electronics sector, shielding delicate components from environmental hazards is critical. The condensation-cure potting compound 3300 series delivers low viscosity, wide-temperature endurance, flame and water resistance, forming a reliable protective barrier.

Performance Edge  
• Low viscosity 25 000 mPa·s fills complex geometries without voids.  
• Operating range –50 °C to 250 °C.  
• Flame class UL 94 HB/V0; water rating IPX4–IPX8.

Choices for Every Need  
Colors: transparent, white, gray, black.  
Hardness: 20 ±5 to 30 ±5 Shore A.  
Example: 3301 (white, 30 ±5 Shore A) for high-visibility needs; 3411 (black, IPX8) for ultimate protection.

Easy Handling & Efficient Cure  
10:1 mix, 30–60 min work time, 4–10 h cure. Vacuum de-air or use automatic dispensers. Final tensile 0.5–1.5 MPa, elongation 150 %.

Applications & Packaging  
PCBs, sensors, power modules, high-voltage and high-frequency devices. Volume resistivity ≥10^14 Ω·cm, dielectric strength ≥15 kV/mm. Shelf life ≥12 months below 30 °C; packages 1 kg–200 kg.