Breaking Environmental Limits: How Condensation-Cure Potting Compound Redefines Electronics Protection
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Traditional materials struggle with complex scenarios. The 3300 series rewrites the rules by combining unique properties.
Core Performance
• Thermal conductivity ≥0.3 W/m·K for heat dissipation.
• Stable εr 2.7–3.3, tan δ ≤0.02 for signal integrity.
• Flame UL 94 HB–V0, water IPX8—ready for fire and flood.
Adhesive vs. Non-Adhesive
3300, 3301, 3411 adhere to components; 3303, 3304 do not—ideal for rework. Example: 3311 for high-strength industrial bonding.
Process Optimization
Mix A:B 10:1, degas under vacuum. Cure 24 h at room temp, 72 h for full adhesion strength. ≥23 °C speeds curing.
Case Studies
• EV battery management systems protected from vibration and moisture.
• 5G modules run reliably thanks to high dielectric performance.
IoT expansion will broaden use.
Sustainability & Economics
Long shelf life, easy storage, multiple pack sizes lower SME procurement costs. Sediment redisperses with simple stirring.