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Invisible Armor for Electronics: Condensation-Cure Silicone Excels in Harsh Environments

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As devices become more sophisticated, protecting core components is paramount. Condensation-cure potting silicone is now the go-to material.

All-Round Protection  
• Low viscosity, –50 °C to 250 °C endurance, flame & water resistance.  
• Shock, vibration, moisture, ozone and chemical resistance.  
• Volume resistivity ≥10^14 Ω·cm, 15 kV/mm dielectric strength, εr 2.7–3.3 for high-frequency insulation.  
• Flame UL 94 HB–V0, water IPX8.

Flexible Options  
Colors: transparent, white, gray, black.  
Viscosity 2,500 ±500 to 25,000 mPa·s.  
3300 for transparency; 3411 & 3311 for adhesion.

User-Friendly & Fast  
10:1 mix, 30–60 min work time. Vacuum de-air and self-leveling eliminate bubbles. 24 h room-temp cure; heat accelerates. Adhesive versions reach full strength in 72 h.

Storage & Packaging  
Shelf life 12 months <30 °C, unopened. Sizes 0.5 kg–200 kg.

Condensation-cure potting compound delivers comprehensive performance for new-energy vehicles, PV inverters, 5G base stations and other high-end electronics.

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