The stable operation of electronic components is inseparable from reliable protective materials. Recently, a series of condensation-type electronic potting adhesives with comprehensive performance have been officially launched on the market. With characteristics such as low viscosity, resistance to high and low temperatures, fire and water resistance, they provide all-round protection for electronic components from impact, vibration, moisture, and corrosion, becoming a new choice in the electronics manufacturing industry.  

The core advantage of this series of potting adhesives lies in their multi-scenario protection capabilities. They can effectively resist environmental hazards such as dust, ozone, and chemicals, and perform particularly well under extreme conditions: the operating temperature ranges from -50°C to 250°C, maintaining stable performance whether in outdoor equipment in frigid regions or industrial instruments operating at high temperatures. The fire resistance rating ranges from UL94-HB to V0, and the maximum waterproof rating reaches IPX8, which can meet the protection needs from ordinary electronic devices to underwater instruments, providing precise protection solutions for different scenarios.  

The performance parameters show balanced technical strength. The series includes 7 models such as 3300 and 3301, with colors covering transparent, white, gray, and black, adapting to different appearance requirements. The density is 0.98-1.02g/cm³, and the lightweight design does not increase the burden on the equipment; the elongation at break of 150% and the tensile strength of 0.5-1.5MPa ensure that the material is not easy to crack under vibration; the electrical properties of volume resistivity ≥10¹⁴Ω·cm and breakdown voltage ≥15KV/mm ensure the insulation safety of electronic components. Some models have a thermal conductivity of ≥0.6W/m·K, which also has heat dissipation function, suitable for high-power devices.  

Production adaptability is also worthy of attention. It adopts a 10:1 ratio of AB components. After mixing, it can self-level, and combined with vacuum degassing or automatic potting machines, it can effectively eliminate bubbles; it basically cures at room temperature in 24 hours, and can be accelerated in high-temperature environments, flexibly adapting to different production rhythms. The combination of 200kg large packaging and 1kg small packaging meets the needs of mass production and experiments. The shelf life is 12 months when stored below 30°C, which is convenient for inventory management.  

From consumer electronics to industrial control, this condensation-type electronic potting adhesive is escorting the stable operation of electronic components with all-round protection capabilities, promoting the electronics manufacturing industry to move towards higher reliability.