With the trend of electronic devices developing towards miniaturization and high power, the performance requirements for component protective materials are becoming increasingly stringent. The advent of the condensation-type electronic potting adhesive series, with its targeted technical design and flexible scenario adaptability, has successfully solved the protection challenges of electronic devices in multiple fields, providing key support for industry technological upgrading.  

The differentiated design of this series of products is its core competitiveness. The 7 models precisely match diverse needs through gradient configuration of fire resistance rating, waterproof performance, and bonding characteristics: for example, model 3411 has UL94-V0 fire resistance rating and IPX8 waterproof capability, suitable for outdoor equipment in harsh environments; model 3300 has a transparent appearance, which is convenient for observing the state of internal components and can bond well with devices; model 3303, with UL94-V1 fire resistance and IPX5 waterproof performance, is suitable for indoor precision instruments. This "on-demand selection" design greatly improves the application flexibility of the material.  

In terms of key performance, the series of products show "all-round" characteristics. The low viscosity allows it to penetrate into the gaps of components to ensure complete wrapping; the tear strength of 1.8KN/mm ensures that it is not easy to be damaged during long-term use; the dielectric constant is 2.7-3.3, and the dielectric loss is ≤0.02, which can maintain signal stability even in high-frequency circuits. It is particularly worth mentioning that its thermal conductivity can reach up to 0.6W/m·K, which helps in heat dissipation while providing protection, solving the overheating hidden danger of high-power devices.  

The optimization of the production process further enhances its market competitiveness. The 10:1 component ratio is easy to measure and mix. The adaptability of vacuum degassing and automatic potting machines reduces bubble generation and improves potting quality; the room temperature curing characteristic reduces energy consumption, and the curing speed can be adjusted by temperature, balancing production efficiency and product performance. Even if precipitation occurs after long-term storage, it can still be used normally after stirring evenly, reducing material waste.  

From smart home sensors to new energy vehicle controllers, this potting adhesive has been applied and verified in multiple fields. It can not only meet the requirements of consumer electronics for appearance and lightweight, but also withstand the extreme working conditions of industrial equipment. This "one material with multiple functions" characteristic is promoting electronic manufacturing enterprises to reduce selection costs and improve product reliability. Industry insiders said that the innovative design of the condensation-type electronic potting adhesive series has set a new benchmark for the scenario-based application of electronic protective materials.