With the trend of electronic devices developing towards precision and integration, component protection is facing multiple challenges such as balancing insulation, heat dissipation, and weather resistance. The advent of the addition-type electronic potting adhesive series, with its targeted technical design and scenario-based adaptability, has successfully solved the protection challenges of electronic devices in multiple fields, becoming an important driving force for industrial technological upgrading.  

The differentiated technical design of this series is its core competitiveness. The 4 models precisely match different scenario needs through gradient configuration of performance parameters: models 1301 and 1302, with UL94-V0 flame retardant rating and IPX6 waterproof performance, are suitable for outdoor equipment in harsh environments; model 1303 adopts UL94-V1 flame retardant standard, balancing protection and cost, suitable for indoor industrial instruments; model 1300 has a transparent appearance, which is convenient for observing the internal state, and its IPX4 waterproof rating meets the needs of daily electronic devices. This "customized on demand" design greatly improves the application flexibility of the material.  

In terms of key performance, the series of products show the dual advantages of "protection + function". The low viscosity ensures complete wrapping of tiny components; the 1:1 mixing ratio simplifies production operations; the self-leveling property reduces manual intervention. High thermal conductivity models can quickly conduct heat from devices, solving the pain point that traditional potting adhesives "are difficult to balance protection and heat dissipation"; excellent electrical performance ensures the stable operation of circuits in complex environments, and even when the temperature changes drastically, the insulation performance remains undiminished.  

Production adaptability further enhances market competitiveness. The room temperature curing characteristic reduces energy consumption, and the curing speed can be adjusted by temperature to meet different production cycle needs; precipitation that occurs after long-term storage can be used normally after stirring, reducing material waste. The diversified packaging specifications provide convenience from R&D experiments to mass production, helping enterprises reduce costs and improve efficiency.  

At present, this series of potting adhesives has been widely used in fields such as communication base stations and automotive electronics. Its stable performance in complex environments not only improves the reliability of electronic devices, but also promotes the development of protective materials towards "multi-functional integration", injecting new momentum into the technological upgrading of the electronics manufacturing industry.