In the context where the electronics manufacturing industry pursues the dual goals of "efficient production" and "reliable quality", the performance and production adaptability of protective materials have become core competitiveness. The addition-type electronic potting adhesive series, with its balanced performance indicators and efficient production process design, is reshaping the application standards of electronic protective materials, providing a new path for cost reduction and efficiency improvement in the industry.  

This series has achieved comprehensive breakthroughs in protection performance. It can not only resist physical damage such as vibration and impact, but also isolate corrosive factors such as moisture and chemicals. The temperature resistance range of -50°C to 250°C ensures stable performance in extreme environments. The electrical performance is particularly excellent: volume resistivity ≥10¹⁴Ω·cm and breakdown voltage ≥20KV/mm ensure circuit insulation safety; the low dielectric loss characteristic ensures that high-frequency signal transmission is not disturbed. Some models with high thermal conductivity solve the heat dissipation problem of high-power devices, realizing "integration of protection and heat dissipation".  

The optimization of production efficiency is another highlight. The 1:1 ratio of AB components simplifies the metering and mixing process, reducing operational difficulty; good fluidity allows it to self-level, and combined with automatic potting machines, it can realize automated production, greatly improving efficiency. The characteristic of basic curing at room temperature in 24 hours eliminates the need for additional heating equipment, and curing can be accelerated in high-temperature environments, flexibly responding to order cycle pressures. Even if precipitation occurs after long-term storage, it can still be used normally after stirring evenly, reducing material waste.  

The detailed design demonstrates a deep understanding of the needs of the manufacturing industry. Diversified color choices meet different appearance needs, and transparent models are convenient for observing the state of internal components; the combination of sample packaging and mass production packaging takes into account R&D and production needs; the 12-month shelf life when stored below 30°C is convenient for supply chain planning. These designs can significantly reduce operational complexity and improve overall production efficiency in actual production.  

At present, this series of potting adhesives has been applied in fields such as smart devices and new energy electronics. Its precise balance between protection performance and production efficiency not only improves the reliability of electronic devices, but also helps manufacturing enterprises optimize processes and reduce costs, providing strong support for the high-quality development of the electronics manufacturing industry.